Reverse conducting igbt incorporating epitaxial layer field stop zone and fabrication method

ABSTRACT

An RC-IGBT includes a semiconductor body formed having a base region incorporating a field stop zone where the base region and the field stop zone are both formed using an epitaxial process and the field stop zone has an enhanced doping profile to realize improved soft-switching performance for the semiconductor device. In alternate embodiments, RC-IGBT device, including the epitaxial layer field stop zone, are realized through a fabrication process that uses front side processing only to form the backside contact regions and the front side device region. The fabrication method forms an RC-IGBT device using front side processing to form the backside contact regions and then using wafer bonding process to flip the semiconductor structure onto a carrier wafer so that front side processing is used again to form the device region.

BACKGROUND OF THE INVENTION

Semiconductor devices, such as discrete diodes and discrete insulatedgate bipolar transistors, are typically formed in a semiconductor bodyincluding a lightly doped base region formed on a heavily dopedsubstrate as the backside cathode/collector. The device region, such asthe pn junction of the semiconductor device, is formed on the top orfront side of the semiconductor body. In order to realize soft switchingbehavior in these semiconductor devices, especially when the thicknessof the base region has to be kept thin, the semiconductor body oftenincorporates a field stop zone away from the device region and close tothe backside substrate. The field stop zone is a region having the samedoping type as the base region but with increased doping level ascompared to the base region. The field stop zone has the effect ofpreventing the space charge region of the pn junction from propagatingtoo far into the lightly doped base region. In practice, the field stopzone prevents the space charge region of the pn junction from reachingthe backside cathode/collector. In this manner, the base region can beformed using the desired low doping levels and with the desiredthickness while achieving soft switching for the semiconductor devicethus formed.

Conventional methods for forming the field stop zone typically involveusing high energy backside dopant implantation. The wafer is put throughthe front-side processing to form the device region and then the waferis subjected to backside grinding to the desired thickness. Then, toform the field stop zone, one or more backside implantation is performedto introduce dopants into an area of the base region that is distantfrom the device region. For example, conventional methods typically useproton implantation or multiple helium or hydrogen implantations fromthe wafer backside to form the field stop zone. Then, a thermal annealis carried out to activate the hydrogen-related donors. FIG. 1duplicates FIG. 1 of U.S. Pat. No. 7,538,412 and illustrates an IGBTformed including a field stop zone 26 formed by high energy backsideimplantation. FIG. 2 duplicates FIG. 2a of the U.S. Pat. No. 7,538,412and illustrates an example doping profile of the field stop region as aresult of the multiple backside implantations.

The conventional methods for forming the field stop zone in asemiconductor body have many shortcomings. First, when high energybackside implantation is used, it is difficult to form deeply extendingfield stop zone, which requires extremely high implantation energy whichis either not feasible, limited by implant equipment, or notmanufacturable or associated with unaffordable cost.

Second, when high energy backside implantation is used, the ability toform the desired field stop zone doping profile becomes limited. In somecases, a large number of implantations is needed to form the desireddoping profile. Large number of implantations is not desirable and canbe costly.

Lastly, since the backside implantation and anneal are carried out afterwafer front-side processing is done, the anneal temperature for thebackside implant cannot be too high. For example, the anneal temperaturefor the backside implant cannot exceed 500° C. or 550° C. because of themetallization layer formed on the front side. The available annealtemperature range limits the implantation dose and energy that can beused for the backside implant because higher implant dose or higherimplant energy requires longer thermal process to anneal the implantdamage or defects.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the invention are disclosed in the followingdetailed description and the accompanying drawings.

FIG. 1 duplicates FIG. 1 of U.S. Pat. No. 7,538,412 and illustrates anIGBT formed including a field stop zone 26 formed by high energybackside implantation.

FIG. 2 duplicates FIG. 2a of the U.S. Pat. No. 7,538,412 and illustratesan example doping profile of the field stop region as a result of themultiple backside implantations.

FIG. 3, which includes FIGS. 3(a) to 3(c), are cross-sectional views ofsemiconductor devices that can be constructed using the epitaxial layerfield stop zone in embodiments of the present invention.

FIG. 4, which includes FIGS. 4(a) to 4(b), are cross-sectional views ofexamples of semiconductor body incorporating an epitaxial layer fieldstop zone which can be used to form semiconductor devices in embodimentsof the present invention.

FIG. 5, which includes FIGS. 5(a) and 5(b), illustrates a semiconductorbody incorporating an epitaxial layer field stop zone and a gradeddoping profile which can be formed in the field stop zone in embodimentsof the present invention.

FIG. 6, which includes FIGS. 6(a)-6(c), illustrates a semiconductor bodyincorporating an epitaxial layer field stop zone and a stepped dopingprofile which can be formed in the field stop zone in embodiments of thepresent invention.

FIG. 7, which includes FIGS. 7(a)-6(c), illustrates a semiconductor bodyincorporating an epitaxial layer field stop zone and a spike dopingprofile which can be formed in the field stop zone in embodiments of thepresent invention.

FIG. 8, which includes FIGS. 8(a) and 8(b), are cross-sectional views ofRC-IGBT semiconductor devices that can be constructed using theepitaxial layer field stop zone in embodiments of the present invention.

FIG. 9, which includes FIGS. 9(a) to 9(h), illustrates the semiconductordevice fabrication method for forming an RC-IGBT in embodiments of thepresent invention.

DETAILED DESCRIPTION

The invention can be implemented in numerous ways, including as aprocess; an apparatus; a system; and/or a composition of matter. In thisspecification, these implementations, or any other form that theinvention may take, may be referred to as techniques. In general, theorder of the steps of disclosed processes may be altered within thescope of the invention.

A detailed description of one or more embodiments of the invention isprovided below along with accompanying figures that illustrate theprinciples of the invention. The invention is described in connectionwith such embodiments, but the invention is not limited to anyembodiment. The scope of the invention is limited only by the claims andthe invention encompasses numerous alternatives, modifications andequivalents. Numerous specific details are set forth in the followingdescription in order to provide a thorough understanding of theinvention. These details are provided for the purpose of example and theinvention may be practiced according to the claims without some or allof these specific details. For the purpose of clarity, technicalmaterial that is known in the technical fields related to the inventionhas not been described in detail so that the invention is notunnecessarily obscured.

In embodiments of the present invention, a semiconductor device includesa semiconductor body having a base region incorporating a field stopzone where the base region and the field stop zone are both formed usingan epitaxial process. Furthermore, the epitaxial layer field stop zoneis formed with an enhanced doping profile to realize improvedsoft-switching performance for the semiconductor device. In someembodiments, the enhanced doping profile formed in the field stop zoneincludes varying, non-constant doping levels. In some embodiments, theenhanced doping profile includes one of an extended graded dopingprofile, a multiple stepped flat doping profile, or a multiple spikedoping profile. The epitaxial layer field stop zone of the presentinvention enables complex field stop zone doping profiles to be used toobtain the desired soft-switching characteristics in the semiconductordevice.

In embodiments of the present invention, the semiconductor device thatcan be formed using the epitaxial layer field stop zone includesdiscrete PN junction diodes and insulated gate bipolar transistor (IGBT)devices. Furthermore, in some embodiments, the semiconductor device is areverse conducting IGBT (RC-IGBT) device where the field stop zone withenhanced doping profile is incorporated to improve the soft-switchingcharacteristics of the RC-IGBT.

The epitaxial layer field stop zone with enhanced doping profile formedin a semiconductor device realizes many advantages over conventionalfield stop zone formed using backside ion implantations. In particular,the epitaxial process makes it possible to form the field stop zone withsophisticated doping profiles which are not possible or very difficultto form using backside implantation method. In this manner, the dopingprofile of the field stop zone can be tailored to meet specificrequirements of the semiconductor device and to realize specificelectrical characteristics for the semiconductor device. The epitaxiallayer field stop zone with the enhanced doping profile improves the softswitch performance of IGBT and diode devices, reducing current ringingand reverse voltage spiking. The epitaxial layer field stop zone withthe enhanced doping profile is also beneficial to achieve balancebetween improved short-circuit ruggedness and desired leakage currentcharacteristics on IGBT devices. The overall electrical characteristicsfor the semiconductor device can be greatly improved.

Second, by using the epitaxial layer field stop zone in accordance withembodiments of the present invention, the semiconductor device can beformed without using backside processing on thin wafer and the fieldstop zone process is compatible with existing front-side processing.Forming the field stop zone using the epitaxial process is thus morecost effective and process friendly as compared to the conventionalmethod of backside ion implantation.

Third, by using the epitaxial process to form the field stop zone andthe base region, the thickness of the base region, which is the depth ofthe field stop zone, can be well controlled to obtain the desired depthfor the field stop zone. Control of the depth of the field stop zone isnot easily achieved using the conventional backside implantation method.

Epitaxial Field Stop Zone

FIG. 3, which includes FIGS. 3(a) to 3(c), are cross-sectional views ofsemiconductor devices that can be constructed using the epitaxial layerfield stop zone in embodiments of the present invention. Referring toFIG. 3(a), a discrete PN junction diode 10 is formed in a semiconductorbody including a heavily doped N+ substrate 12 and an N-type epitaxiallayer 13 formed thereon. The N+ substrate 12 forms the backside cathodeof the diode 10. An N-type base region (N-Base) 15 and a field stop zone14 are formed in the N-type epitaxial layer 13 where the field stop zone14 is formed using an enhanced doping profile, such as extended gradeddoping profile or multiple stepped flat doping profile or others. Thefield stop zone 14 is formed in a lower portion of the epitaxial layer13, adjacent to the substrate 12, and the N-base 15 is formed on thefield stop zone 14. A P-body region 16 is formed in the top or frontside of the N-Base 15, away from the field stop zone 14. A heavily dopedP-type (P+) region 17 is formed in the P-body region 16 as the anode ofthe diode 10. As thus configured, a PN junction is formed between theP-body 16 and N-Base 15. The field stop zone 14 functions as the driftregion of the diode 10 and prevents the space charge region formed atthe P-body and N-Base junction from extending to the N+ substrate 12.Specific field stop zone doping profiles can be selected for the fieldstop zone 14 to achieve the desired soft switching characteristics. Inembodiments of the present invention, the field stop zone has a dopingprofile having doping levels that vary within the field stop zone. Thatis, the doping levels in the field stop zone are not constant throughoutthe field stop zone.

Referring to FIG. 3(b), a discrete IGBT 20 is formed in a semiconductorbody including a P-type substrate 22 and an N-type epitaxial layer 23formed thereon. The P-type substrate 22 forms the backsidecollector/drain of the IGBT 20. An N-type base region (N-Base) 25 and afield stop zone 24 are formed in the N-type epitaxial layer 23 where thefield stop zone 24 is formed using an enhanced doping profile, such asextended graded doping profile or multiple stepped flat doping profileor others. The field stop zone 24 is formed in a lower portion of theepitaxial layer 23, adjacent to the substrate 22, and the N-base 25 isformed on the field stop zone 24. A P-body region 26 is formed in thetop or front side of the N-Base 25, away from the field stop zone 24.The P-body region 26 houses a heavily doped N+ emitter/source region 27.A conductive gate 29 of the IGBT is formed on and insulated from the topor front side of the epitaxial layer 23 by a gate dielectric layer 28.The conductive gate 29 is typically a polysilicon layer and the gatedielectric layer 28 is typically a thin gate oxide layer. In the presentexample, the conductive gate 29 is positioned in the center of the frontside of the semiconductor body and the N+ source region 27 and theP-body region 26 are formed on the sides of the gate 29 or surround thegate 29. As thus configured, the IGBT 20 is formed with a PN junctionbetween the P-body 26 and N-Base 25. The field stop zone 24 functions asthe drift region of the IGBT 20 and prevents the space charge regionformed at the P-body and N-Base junction from extending to the P-typesubstrate 22. Specific field stop zone doping profiles can be selectedfor the field stop zone 24 to achieve the desired soft switchingcharacteristics. In embodiments of the present invention, the field stopzone has a doping profile having doping levels that vary within thefield stop zone. That is, the doping levels in the field stop zone arenot constant throughout the field stop zone.

Referring to FIG. 3(c), a discrete trench IGBT 30 is formed in asemiconductor body including a P-type substrate 32 and an N-typeepitaxial layer 33 formed thereon. The P-type substrate 32 forms thebackside collector/drain of the trench gate IGBT 30. An N-type baseregion (N-Base) 35 and a field stop zone 34 are formed in the N-typeepitaxial layer 33 where the field stop zone 34 is formed using anenhanced doping profile, such as extended graded doping profile ormultiple stepped flat doping profile or others. The field stop zone 34is formed in a lower portion of the epitaxial layer 33, adjacent to thesubstrate 32, and the N-base 35 is formed on the field stop zone 34. AP-body region 36 is formed in the top or front side of the N-Base 35,away from the field stop zone 34. The P-body region 36 houses a heavilydoped N+ emitter/source region 37. A trench gate 39 of the IGBT 30 isformed in a trench formed in the front side of the epitaxial layer 33.The trench gate 39 is insulated from the sidewall of the trench by agate dielectric layer 38. The trench gate 39 is typically a polysiliconlayer and the gate dielectric layer 38 is typically a thin gate oxidelayer. In the present example, the trench gate 39 is positioned in thecenter of the front side of the semiconductor body and the N+ sourceregion 37 and the P-body region 36 are formed on the sides of the trenchgate 39 or surround the trench gate 39. As thus configured, the trenchgate IGBT 30 is formed with a PN junction between the P-body 36 andN-Base 35. The field stop zone 34 functions as the drift region of thetrench IGBT 30 and prevents the space charge region formed at the P-bodyand N-Base junction from extending to the P-type substrate 32. Specificfield stop zone doping profiles can be selected for the field stop zone34 to achieve the desired soft switching characteristics. In embodimentsof the present invention, the field stop zone has a doping profilehaving doping levels that vary within the field stop zone. That is, thedoping levels in the field stop zone are not constant throughout thefield stop zone.

FIG. 4, which includes FIGS. 4(a) to 4(b), are cross-sectional views ofexamples of semiconductor body incorporating an epitaxial layer fieldstop zone which can be used to form semiconductor devices in embodimentsof the present invention. Referring to FIG. 4(a), a semiconductor body40 has an N+ substrate 42 and an N-type epitaxial layer 43 formedthereon by an epitaxial process. The epitaxial layer 43 is formed toinclude a field stop zone epitaxial layer 44 formed on the N+ substrate42 and an N-type base region (N-Base) 45 formed on the field stop zoneepitaxial layer 44. More specifically, the epitaxial process grows theN-type epitaxial layer 43 onto the N+ substrate 42. The epitaxialprocess is carried out by adjusting the N-type doping concentration toform the desired doping profile for the field stop zone 44 and then toform the constant doping level for the N-Base 45.

More specifically, during the first portion of the epitaxial process,the N-type doping concentration being used is adjusted or varied to formthe epitaxial layer for the field stop zone 44 having the desired dopingprofile. The doping level is not constant throughout the field stop zone44 but instead a varying doping level is used to create a doping profilethat is useful in supporting robust soft switching characteristics inthe semiconductor device to be formed. Then, when the field stop zoneepitaxial layer 44 is completed, the epitaxial process continues with aconstant N-type doping level to form the base region epitaxial layer 45.In some embodiments, the base region epitaxial layer 45 is lightly dopedand the doping level for the N-base region 45 establishes the minimumdoping level of the field stop zone. The field stop zone 44 includesregions having higher doping levels than the N-base region with specificdoping profile being selected to achieve the desired soft switchingbehavior for the semiconductor device to be formed. Furthermore, thedoping levels within the field stop zone 44 are not constant but varywithin the field stop zone to achieve the desired soft switchingcharacteristics.

In the embodiment shown in FIG. 4(a), the semiconductor body 40 includesan N+ substrate 42 which is useful for forming a PN junction diodedevice. In other embodiments, the epitaxial layer field stop zone can beapplied in a semiconductor body including other types of substrate, suchas N-type or P-type substrate, and heavily doped or lightly dopedsubstrate of either dopant polarity. The use of a specific substrate inthe present description is illustrative only and is not intended to belimiting. For example, FIG. 4(b) illustrates a semiconductor body 48including a P-type substrate 41. The N-type epitaxial layer 43 is formedon the P-type substrate 41 in the same manner as described above withreference to FIG. 4(a) to form the field stop zone epitaxial layer 44and the N-Base epitaxial layer 45. The semiconductor body 48 is usefulfor forming an IGBT device, including a trench gate IGBT device.

As thus formed, the semiconductor body 40 or 41 can then be used to formthe desired semiconductor device by applying front side processing tothe wafer surface of the N-base 45. No backside processing is requiredfor the semiconductor device as the field stop zone is already formed.In embodiments of the present invention, the epitaxial layer field stopzone is formed with enhance doping profile to achieve the desired softswitching behavior in the semiconductor device to be formed. The belowdescription provides examples of doping profiles which can be formed inthe field stop zone. The doping profile examples below are illustrativeonly and are not intended to be limiting. One of ordinary skilled in theart would appreciate that different doping profiles can be achieved forthe field stop zone by adjusting the N-type doping concentration duringthe epitaxial process.

(1) Extended Graded Doping Field Stop Zone

FIG. 5, which includes FIGS. 5(a) and 5(b), illustrates a semiconductorbody incorporating an epitaxial layer field stop zone and a gradeddoping profile which can be formed in the field stop zone in embodimentsof the present invention. FIG. 5(a) duplicates FIG. 4(a) and illustratesthe semiconductor body 40 including the N+ substrate 42 and an N-typeepitaxial layer 43 formed thereon. FIG. 5(b) illustrates an extendedgraded doping profile 50 which can be formed in the epitaxial layerfield stop zone in the present example. The doping profile shown in FIG.5(b) illustrates the N-type doping concentration from the N+ substrate42 to the N-base 45 from left to right.

In the present example, the substrate 42 is a heavily doped N-typesubstrate and thus the substrate 42 has a high N-type dopingconcentration. The epitaxial process grows the epitaxial layer 43 on thesubstrate 42. The field stop zone has an extended graded doping profile50. That is, the field stop zone has a starting doping level, lower thanthe doping level of the N+ substrate and the doping level of the fieldstop zone decreases linearly to an ending doping level. The N-Baseregion 45 is then formed with the epitaxial layer having a constantdoping level. The N-Base region 45 is typically lightly doped and thusthe N-Base region 45 has a low N-type doping level. The ending dopinglevel of the field stop zone 44 can be the same as or higher than thedoping level of the N-Base region 45.

In embodiments of the present invention, the graded doping profile ofthe field stop zone can be tuned to obtain the desired layer thicknessand doping level for the field stop zone. Furthermore, the layerthickness of the N-base region 45 can be tuned to obtain the desireddepth of the field stop zone from the wafer surface. Accordingly, byusing the epitaxial process, a field stop zone with a deeply extendedgraded doping profile can be formed at a desired depth from the wafersurface. The thickness and doping level of the field stop zone 44 definethe depletion layer depth and determines the working voltage of thesemiconductor device to be formed. By incorporating the field stop zonewith the graded doping profile, large operating voltage changes will notresult in dramatic changes in the depletion layer depth. In this manner,voltage spiking and current ringing are reduced and the semiconductordevice to be formed has improved soft switching behavior.

In one embodiment, the epitaxial process for forming the epitaxial layer43 uses two N-type doping concentration set points during the epitaxygrowth process to form the field stop zone. The epitaxial process beginsthe epitaxy growth at the field stop zone starting doping concentration.The epitaxy growth rate is fixed while the doping gas flow is reducedgradually so that when the desired thickness for the field stop zone isreached, the epitaxial process is at the field stop zone ending dopingconcentration. Accordingly, the rate of doping gas flow reduction is afunction of the desired graded doping and the thickness of the fieldstop zone. After the field stop zone is formed, the epitaxial processcontinues at a constant N-type doping concentration set point to formthe base region epitaxial layer. The constant N-type dopingconcentration set point for the base region can be the same as or lessthan the field stop zone ending doping concentration.

(2) Multiple Stepped Flat Doping Field Stop Zone

FIG. 6, which includes FIGS. 6(a)-6(c), illustrates a semiconductor bodyincorporating an epitaxial layer field stop zone and a stepped dopingprofile which can be formed in the field stop zone in embodiments of thepresent invention. FIG. 6(a) duplicates FIG. 4(a) and illustrates thesemiconductor body 40 including the N+ substrate 42 and an N-typeepitaxial layer 43 formed thereon. FIGS. 6(b) and 6(c) illustrateexamples of the stepped doping profiles 55, 60 which can be formed inthe epitaxial layer field stop zone in the present embodiment. Thedoping profiles shown in FIGS. 6(b) and 6(c) illustrate the N-typedoping concentration from the N+ substrate 42 to the N-base 45 from leftto right.

In the embodiment shown in FIG. 6(b), the substrate 42 is a heavilydoped N-type substrate and thus the substrate 42 has a high N-typedoping concentration. The epitaxial process grows the epitaxial layer 43on the substrate 42. The field stop zone 43 has a multiple stepped flatdoping profile 55. That is, the field stop zone has a background dopinglevel and multiple flat top regions with step increase in doping levels.The flat top regions are spaced apart in the field stop zone. The N-Baseregion 45 is then formed with the epitaxial layer having a constantdoping level. The N-Base region 45 is typically lightly doped and thusthe N-Base region 45 has a low N-type doping level. The backgrounddoping level of the field stop zone 44 can be the same as or higher thanthe doping level of the N-Base region 45.

In the example shown in FIG. 6(b), the field stop zone includes threeflat top regions having substantially the same width or same epitaxiallayer thickness and with increasing doping levels. That is, the flat topregion closer to the substrate has lower doping level than the flat topregion farthest from the substrate and the doping level increasesgradually from the first flat top region near the substrate to the lastflat top region near the N-base region.

In other embodiments, the width or thickness of the flat top regions,the spacing of the flat top regions and the doping level of the flat topregions can be tuned to obtain the desired doping profile for the fieldstop zone. In particular, the doping levels or the thickness of the flattop region can be selected based on the application voltage of thesemiconductor device to be formed. For example, in other embodiments,the flat top regions can all have the same doping levels. In anotherexample, the flat top regions can have different width or epitaxiallayer thicknesses while having the same or different doping levels. Thedoping levels can increase towards the N-base region or decrease towardsthe N-base region. In one example, the flat top region closes to theN-base region can have a higher doping level or an increased thicknessas compared to the flat top regions closer to the substrate to stop thespread of the depletion layer under certain application voltage levelsso as to reduce current ringing.

FIG. 6(c) illustrates an alternate embodiment of the stepped flat dopingprofile 60 where the field stop zone includes multiple stepped flat topregions having the same doping level but with different epitaxial layerthickness. In the example shown in FIG. 6(c), the flat top regionsincrease in layer thickness, illustrated as increasing width in thedoping profile in FIG. 6(c), from the first flat top region near thesubstrate to the last flat top region near the N-base region.

The multiple stepped flat doping profiles described herein can beapplied in a field stop zone to improve the soft-switching behavior ofthe semiconductor device to be formed. The stepped doping levels and thethicknesses of the flat top regions as well as the number of flat topregions can be selected to tune the electric field shape or electricfield distribution for improved ruggedness in the semiconductor devicethus formed. Furthermore, the layer thickness of the N-base region 45can be tuned to obtain the desired depth of the field stop zone from thewafer surface. Accordingly, by using the epitaxial process, a field stopzone with a multiple stepped flat doping profile can be formed at adesired depth from the wafer surface.

In one embodiment, the epitaxial process forms the multiple stepped flatdoping profile as the field stop zone in the epitaxial layer 43 bysetting the epitaxy growth doping gas flow to the background dopinglevel and then applying and holding the doping gas flow for the flat topregions. More specifically, the epitaxial process begins the epitaxygrowth by setting the doping gas flow to the background dopingconcentration. The epitaxy growth rate is fixed. As the epitaxy growthprogresses, the doping gas flow is increased to form the stepped flattop region and the increased doping gas flow is held for the target flattop region thickness. After the desired flat top region is formed, thedoping gas flow returns to the background doping concentration set pointand the epitaxy process continues until the next flat top region is tobe formed. After the field stop zone is formed, the epitaxial processcontinues at a constant N-type doping concentration set point to formthe base region epitaxial layer. The constant N-type dopingconcentration set point for the base region can be the same as or lessthan the field stop zone background doping concentration.

(3) Multiple Spike Doping Field Stop Zone

FIG. 7, which includes FIGS. 7(a)-6(c), illustrates a semiconductor bodyincorporating an epitaxial layer field stop zone and a spike dopingprofile which can be formed in the field stop zone in embodiments of thepresent invention. FIG. 7(a) duplicates FIG. 4(a) and illustrates thesemiconductor body 40 including the N+ substrate 42 and an N-typeepitaxial layer 43 formed thereon. FIGS. 7(b) and 7(c) illustrateexamples of the spike doping profiles 65, 70 which can be formed in theepitaxial layer field stop zone in the present embodiment. The dopingprofiles shown in FIGS. 7(b) and 7 c) illustrate the N-type dopingconcentration from the N+ substrate 42 to the N-base 45 from left toright.

In the embodiment shown in FIG. 7(b), the substrate 42 is a heavilydoped N-type substrate and thus the substrate 42 has a high N-typedoping concentration. The epitaxial process grows the epitaxial layer 43on the substrate 42. The field stop zone 43 has a multiple spike dopingprofile 65. That is, the field stop zone has a background doping leveland multiple spike doping regions with spike increase in doping levels.The spike doping regions are spaced apart in the field stop zone. TheN-Base region 45 is then formed with the epitaxial layer having aconstant doping level. The N-Base region 45 is typically lightly dopedand thus the N-Base region 45 has a low N-type doping level. Thebackground doping level of the field stop zone 44 can be the same as orhigher than the doping level of the N-Base region 45.

In the example shown in FIG. 7(b), the field stop zone includes twospike doping regions having substantially the same width or sameepitaxial layer thickness and with the same doping level. In otherembodiments, the number of flat top regions within the field stop zone,the width or thickness of the spike doping regions, the spacing of thespike doping regions and the doping level of the spike doping regionscan be tuned to obtain the desired doping profile for the field stopzone. In particular, the doping levels or the thickness of the spikedoping region can be selected based on the application voltage of thesemiconductor device to be formed. For example, in other embodiments,the spike doping regions can all have the same doping levels. In anotherexample, the spike doping regions can have different width or epitaxiallayer thicknesses while having the same or different doping levels. Thedoping levels can increase towards the N-base region or decrease towardsthe N-base region. In one example, the spike doping region closes to theN-base region can have a higher doping level or an increased thicknessas compared to the spike doping regions closer to the substrate to stopthe spread of the depletion layer under certain application voltagelevels so as to reduce current ringing.

FIG. 7(c) illustrates an alternate embodiment of the spike dopingprofile 70 where the field stop zone includes three spike doping regionswith increasing doping levels from the first spike doping region nearthe substrate to the last spike doping region ear the N-Base region.Furthermore, the spike doping regions of FIG. 7(d) has increasingthickness, illustrated as increasing width in the doping profile in FIG.7(c), from the first spike doping region near the substrate to the lastspike doping region near the N-base region.

The multiple spike doping profiles described herein can be applied in afield stop zone to improve the soft-switching behavior of thesemiconductor device to be formed. The doping levels and the thicknessesof the spike doping regions as well as the number of spike dopingregions can be selected to tune the electric field shape or electricfield distribution for improved ruggedness in the semiconductor devicethus formed. Furthermore, the layer thickness of the N-base region 45can be tuned to obtain the desired depth of the field stop zone from thewafer surface. Accordingly, by using the epitaxial process, a field stopzone with a multiple spike doping profile can be formed at a desireddepth from the wafer surface.

In one embodiment, the epitaxial process forms the multiple spike dopingprofile as the field stop zone in the epitaxial layer 43 by setting theepitaxy growth doping gas flow to the background doping level and thenchanging the doping gas flow rapidly to form the spike doping regions.More specifically, the epitaxial process begins the epitaxy growth bysetting the doping gas flow to the background doping concentration. Theepitaxy growth rate can be adjustable or non-constant. As the epitaxygrowth progresses, the doping gas flow is increased rapidly and turnedoff rapidly to form the spike doping region. After the desired spikedoping region is formed, the doping gas flow returns to the backgrounddoping concentration set point and the epitaxy process continues untilthe next spike doping region is to be formed. After the field stop zoneis formed, the epitaxial process continues at a constant N-type dopingconcentration set point to form the base region epitaxial layer. Theconstant N-type doping concentration set point for the base region canbe the same as or less than the field stop zone background dopingconcentration.

It is instructive to note that while the conventional backsideimplantation method to form the field stop zone can form one or morepeaks in the doping profiles, the conventional backside implantationmethod is not capable of giving fine control over the location, thethickness or width and the peak doping level of the spike dopingregions. When high energy implantation method is used, only coarsecontrol over the doping profile can be realized. Furthermore, highenergy implantation method cannot form a flat top doping region. Theepitaxial layer field stop zone of the present invention can be formedwith precise control over the location, the thickness and the peakdoping levels of the field stop zone doping profile, ensuring improvedsoft switching behavior.

With the semiconductor body of FIGS. 5-7 thus formed including theepitaxial layer field stop zone with enhanced doping profile, front sideprocessing is then carried out to form the device region of thesemiconductor device to be formed. The device region, such as the pnjunction of the semiconductor device, is formed on the top or front sideof the semiconductor body. For example, a PN junction diode can beformed in the semiconductor body by forming a P-body and a P+ region onthe front side of the semiconductor body, as shown in FIG. 3(a). Inanother example, a semiconductor body using a P-type substrate may beused to form an IGBT device. The semiconductor body is subjected tofront side processing including forming the P-body region, the N+ sourceregion, the gate dielectric layer and the conductive gate, as shown inFIG. 3(b). A trench gate IGBT can also be formed, such as shown in FIG.3(c).

RC-IGBT (Reverse Conducting IGBT)

In embodiments of the present invention, an RC-IGBT includes asemiconductor body formed having a base region incorporating a fieldstop zone where the base region and the field stop zone are both formedusing an epitaxial process, as described above with reference to FIGS.4-7. The epitaxial layer field stop zone is formed with an enhanceddoping profile to realize improved soft-switching performance for thesemiconductor device. In some embodiments, the enhanced doping profileformed in the field stop zone includes varying, non-constant dopinglevels. In some embodiments, the enhanced doping profile formed in thefield stop zone includes one of an extended graded doping profile, amultiple stepped flat doping profile, or a multiple spike dopingprofile, as described above with reference to FIGS. 5-7.

An RC-IGBT or reverse conducting IGBT is an IGBT device with a backsideN+ region to enable current to be conducted from the backside of theRC-IGBT device. In an IGBT, such as IGBT 20 of FIG. 3(b), includes a PNPbipolar transistor formed by the P-type substrate 22, the N-drift/N-baseregion 24, and the P-body region 26 and a MOS transistor formed by theN+ source region 27, the gate 29 and the N-drift region as the drain.The IGBT 20 cannot conduct current from the backside—that is, currentcannot go through the P-body to the N-base/N-drift region to theP-substrate.

An RC-IGBT device integrates an IGBT and a freewheeling diode in thesame device structure and thereby enables backside current conduction.FIG. 8, which includes FIGS. 8(a) and 8(b), are cross-sectional views ofRC-IGBT semiconductor devices that can be constructed using theepitaxial layer field stop zone in embodiments of the present invention.Referring to FIG. 8(a), an RC-IGBT 80 is constructed in the same manneras the IGBT 20 of FIG. 3(b) except for the addition of the N+ region 83on the backside, the collector terminal, of the device, as the backsidecontact region. As thus configured, a diode is formed by the P-bodyregion 86 and the N+ region 83 and backside current conduction is madepossible. Referring to FIG. 8(b), a trench gate RC-IGBT 90 isconstructed in the same manner as the trench gate IGBT 90 of FIG. 3(c)except for the addition of the N+ region 93 on the backside, thecollector terminal, of the device, as the backside contact region. Asthus configured, a diode is formed by the P-body region 96 and the N+region 93 and backside current conduction is made possible.

In embodiments of the present invention, the RC-IGBT 80 of FIG. 8(a) isformed in a semiconductor body including an N-type epitaxial layer 83where the N-type epitaxial layer 83 incorporates a field stop zone 84constructed in the same manner as described above with references toFIGS. 4 to 7. The field stop zone 84 improves the soft switchingbehavior of the RC-IGBT device. Similarly, in embodiments of the presentinvention, the trench gate RC-IGBT 90 of FIG. 8(b) is formed in asemiconductor body including an N-type epitaxial layer 93 where theN-type epitaxial layer 93 incorporates a field stop zone 94 constructedin the same manner as described above with references to FIGS. 4 to 7.The field stop zone 94 improves the soft switching behavior of thetrench gate RC-IGBT device.

RC-IGBT devices require both N+ and P contact regions at the backside ofthe device structure. Forming doped regions on both the front side andthe back side of a wafer, especially for thin wafers, can bechallenging. In embodiments of the present invention, RC-IGBT devices,with surface gate or trench gate, are realized through a fabricationprocess that uses front side processing only to form the backsidecontact regions and the front side device region and incorporate anepitaxial layer field stop zone with enhanced doping profile. Thefabrication process enables RC-IGBT devices to be formed with thebackside contact regions and the epitaxial layer field stop zone evenfor thin wafer thicknesses.

Conventional methods for forming RC-IGBT devices including performingthe front side processing to form the device region (gate dielectric,gate polysilicon, body region, source region, contact and metallization)on the front side of the wafer. The wafer is then flipped over andbackground to the desired thickness. Then backside processing is carriedout to form the N+ and P contact regions. The field stop zone may beformed by backside implantation as well. Laser anneal or a lowtemperature anneal is then performed to activate the implanted dopantsof the field stop zone and the N+ and P regions. The conventional backgrind and backside implantation methods for forming RC-IGBT devices areundesirable for the reasons described above, including the requirementfor backside processing, the inability to control the profile of thefield stop zone and the limitation of the anneal temperature that can beused. In particular, the conventional method requires performingbackside lithographic process on thin wafers which requires speciallithographic equipment to pattern the wafer backside for the N+ and Pregions, special thin film equipment to strip the photoresist on thinwafers, and modification to the implant equipment to performimplantation on thin wafers. Also, the conventional method also requiresspecial laser anneal equipment that can handle thin wafers to performannealing of the implanted N+ and P regions.

In embodiments of the present invention, a semiconductor devicefabrication method for forming an RC-IGBT incorporating an epitaxiallayer field stop zone uses only front side processing to form thebackside N+ and P contact regions. FIG. 9, which includes FIGS. 9(a) to9(h), illustrates the semiconductor device fabrication method forforming an RC-IGBT in embodiments of the present invention. Referring toFIG. 9(a), the method starts with a lightly doped wafer substrate 120 ofeither N-type or P-type. Then an epitaxial process is carried out toform an N-type epitaxial layer 122 on the substrate 120. The epitaxialprocess is carried out by first using a constant doping level to form afirst portion of the epitaxial layer which would become the N-baseregion. The epitaxial process then continues with changing doping levelsto form the second portion of the epitaxial layer which would become thefield stop zone. The doping levels of the epitaxial process can bechanged in the manner as described above with reference to FIGS. 5-7 toform the desired field stop zone doping profile. For example, the secondportion of the epitaxial layer can be formed to have an extended gradeddoping profile, a multiple stepped flat doping profile, or a multiplespike doping profile, suitable for the application of the RC-IGBT.

It is instructive to note that the epitaxial process for forming theN-base and the field stop zone in the method of the present embodimentis reversed in reference to the process described above in FIGS. 4-7. Inthe aforementioned description for forming a PN junction diode or anIGBT, the semiconductor body is formed by growing the epitaxial layer ona given substrate where the substrate would become the backside of thesemiconductor device to be formed. The epitaxial growth starts with thefield stop zone on the substrate and then continues onto the N-baseregion. In the method of the present invention for forming the RC-IGBT,the lightly doped substrate 120 is a sacrificial substrate to enable theformation of the RC-IGBT backside N+ and P contact regions using onlyfront side processing. Therefore, the present method forms thesemiconductor body in a reverse order—by forming the N-base region firstand then forming the field stop zone. One of ordinary skill in the artwould appreciate that the doping profiles in FIGS. 5-7 can be appliedfor an epitaxial process which grows the epitaxial layer from the N-baseto the field stop zone. In this case, the doping profile desired for thefield stop zone can be achieved by adjusting the epitaxy dopingconcentration of the field stop zone as the epitaxial process continuesfrom the end of the N-base region into the field stop zone in a mannerto achieve the field stop zone profiles from right to left as shown inFIG. 5-7.

Referring still to FIG. 9(a), the method grows an N-type epitaxial layer124 as a buffer layer. In some embodiments, the buffer layer has adoping level that is lower than the doping level of the N-base Epitaxiallayer 122 but higher than the doping level of the lightly doped N-typewafer substrate. Referring now to FIG. 9(b), the backside N+ and Pregions of the RC-IGBT are formed in the buffer layer 124 by masking andselectively implanting N-type and P-type dopants. The implanted dopantswill be activated and will diffuse into the buffer layer 124 at a lateranneal process. In the present embodiment, the backside N+ contactregions 128 are formed by masking the buffer layer 124 to expose regions128 for receiving a high dose N+ implant. Then, a blanket P-type implantis performed to form the P contact regions 130 outside of the N+ contactregion 128. After the implantation, the drive-in or anneal process forthe N+ implant and P-type implant can be performed later in thefabrication process, such as together with the implant regions in thedevice regions to be formed on the opposite side of the semiconductorstructure.

FIG. 9(c) illustrates the backside N+ regions 128 and P regions 130formed after a subsequent anneal process. The actual anneal of theimplanted dopants may occur during a later time in the processing. Theformation of the N+ regions 128 and P regions 130 in FIG. 9(c) isillustrative only. After the implantation step for the N+ regions and Pregions in the buffer layer 124, the wafer is subjected a thermaloxidation process which forms a thermal oxide layer 132 on the exposedsurface of the wafer. Thus, the thermal oxide layer 132 is formed on thebuffer layer 124 as well as on the lightly doped substrate 120. Thethermal oxide layer 132 will be used as a bonding layer in subsequentprocessing. Up to this point, the method has only employed front sideprocessing of the semiconductor structure formed on the substrate 120.

Referring to FIG. 9(d), the semiconductor structure as formed in FIG.9(c) is flipped upside down and is attached to a carrier wafer 134. Thethermal oxide layer 132 grown on the buffer layer 124 helps the adhesionof the semiconductor structure to the carrier wafer. With thesemiconductor structure flipped, the N-type epitaxial layer 122 now hasthe second portion forming the field stop zone on the bottom with thefirst portion forming the N-base region on top. The side of thesemiconductor structure with the lightly doped substrate 120 becomes thefront side of the wafer. It is instructive to note that the use of theterms “top” and “bottom” and “front” and “back” are intended to denoterelative directions or positions of the layers in the semiconductorstructure and is not intended to indicate absolute direction orpositioning of the semiconductor structure.

Referring to FIG. 9(e), the front side of the wafer is subjected togrinding and polishing to remove the sacrificial substrate 120 and tothin the N-type epitaxial layer 122 down to the desired N-basethickness. Although the N-type epitaxial layer 122 is thinned, thecarrier wafer 134 provides thickness to the semiconductor structure sothat no special thin wafer processing step or equipment is required.

Referring to FIG. 9(f), front side processing is then carried out toform the device region 140 of the RC-IGBT semiconductor device. Forexample, the body region, the emitter/source region, the gate dielectriclayer, the conductive gate layer, the interlayer dielectric, the contactand the metallization layer are formed using front side processing.Referring to FIG. 9(g), after forming the device region 140, the RC-IGBTdevice is completed. The semiconductor structure is then subjected toback grinding and wet etch to remove the carrier wafer 134 to expose thebackside contact regions previously formed. The thermal oxide layer 132between the backside contact layer and the carrier wafer acts as an etchstop for the wet etch process to remove the carrier wafer. The thermaloxide layer 132 is then also removed, such as by wet etch, to expose thebackside contact regions.

Referring to FIG. 9(h), the back grinding removes the carrier wafer andstops at the thermal oxide layer. Then, the thermal oxide layer isetched, such as using wet etch, to expose the N+ contact regions 128 andP contact regions 130 formed on the backside of the device. Theepitaxial layer field stop zone with an enhanced doping profile isformed above the buffer layer 124 and below the N-base region. It isinstructive to note that the entire RC-IGBT device 150 in FIG. 9(h) isformed using front side processing only and without requiring thin waferequipment or process. That is, no backside lithography, backsideimplantation, or laser anneal is required. The semiconductor devicefabrication method forms the RC-IGBT device 150 using front sideprocessing to form the backside contact regions and then using waferbonding process to flip the semiconductor structure onto a carrier waferso that front side processing is used again to form the device region.The carrier wafer provides the thickness for the semiconductor structureso that the fabrication of the RC-IGBT device does not require specialthin wafer processing equipment or process.

The semiconductor device fabrication method of the present inventionrealizes an RC-IGBT which incorporates an epitaxial layer field stopzone and uses only front side processing to form the backside N+ and Pcontact regions. The semiconductor device fabrication method of thepresent invention simplifies the fabrication process, reducing cost andimproving efficiency of the manufacturing process while forming asemiconductor device with improved soft-switching capability.

In the above described embodiment, the buffer layer 124 is formed by theepitaxial process. In other embodiments, the buffer layer can be formedby implantation of N-type dopants into the N-type epitaxial layer 122being formed to use as the N-base and field stop zone.

In the above described embodiment, the P-type backside contact region130 is formed by implantation into a lightly doped N-Epitaxial bufferlayer. In other embodiments, the P-type backside contact region 130 canbe formed by epitaxial growth and N-type dopants are then implanted intothe P-type epitaxial layer to form the N+ contact regions 128.

Furthermore, in the above described embodiment, the semiconductor devicefabrication method is described for forming a surface gate RC-IGBT. Inother embodiments, the semiconductor device fabrication method of thepresent invention can be applied to form a trench gate RC-IGBT byforming a trench on the front side of the semiconductor structure andforming the trench gate dielectric and the trench gate inside thetrench. The same wafer bonding method applies to enable the trench gateRC-IGBT to be formed using front side processing only.

Although the foregoing embodiments have been described in some detailfor purposes of clarity of understanding, the invention is not limitedto the details provided. There are many alternative ways of implementingthe invention. The disclosed embodiments are illustrative and notrestrictive.

What is claimed is:
 1. (canceled)
 2. (canceled)
 3. (canceled) 4.(canceled)
 5. (canceled)
 6. (canceled)
 7. A method for fabricating areverse conducting insulated gate bipolar transistor (RC-IGBT) deviceincluding a field stop zone, the method comprising: providing a firstsemiconductor substrate being lightly doped; forming, by an epitaxialprocess, a first epitaxial layer of a first conductivity type on thefirst semiconductor substrate, the first epitaxial layer having aconstant doping level, the first epitaxial layer forming a base regionof the RC-IGBT device; forming, by the epitaxial process, a secondepitaxial layer of the first conductivity type on the first epitaxiallayer, the second epitaxial layer having a doping profile includingnon-constant and varying doping levels, the second epitaxial layerforming a field stop zone of the RC-IGBT device; forming a buffer layeron the second epitaxial layer; forming, by ion implantation, firstregions of the first conductivity type and second regions of a secondconductivity type, opposite the first conductivity type, in the bufferlayer; forming a bonding layer on the buffer layer; attaching a carrierwafer to the bonding layer formed on the buffer layer to form asemiconductor structure having a first side being the firstsemiconductor substrate and a second side being a back side of thecarrier wafer; grinding the semiconductor structure from the first sideto remove the first semiconductor substrate and at least a part of thefirst epitaxial layer, an exposed surface of the first epitaxial layerbeing a front side of the semiconductor structure; forming, from thefront side of the semiconductor structure, a body region of the secondconductivity type, and forming a source region of the first conductivitytype in the body region; forming a gate dielectric layer and aconductive gate on the front side of the semiconductor structure; andremoving the carrier wafer and the bonding layer to expose the firstregions of the first conductivity type and the second regions of thesecond conductivity type in the buffer layer.
 8. The method of claim 7,wherein forming, by the epitaxial process, the second epitaxial layer ofthe first conductivity type on the first epitaxial layer comprises:forming the second epitaxial layer having a graded doping profile, thesecond epitaxial layer having a first side adjacent the first epitaxiallayer and a second side adjacent the buffer layer, the graded dopingprofile having a first doping level at the first side and a seconddoping level at the second side of the second epitaxial layer, thedoping level varying linearly between the first side and the second sideof the second epitaxial layer from the first doping level to the seconddoping level.
 9. The method of claim 8, wherein the first doping levelis lower than the second doping level.
 10. The method of claim 9,wherein the first doping level is higher than or the same as theconstant doping level of the first epitaxial layer.
 11. The method ofclaim 7, wherein forming, by the epitaxial process, the second epitaxiallayer of the first conductivity type on the first epitaxial layercomprises: forming the second epitaxial layer having a multiple steppedflat doping profile having a first doping level as a background dopinglevel and having multiple flat top regions with step increase in dopinglevels from the first doping level, the multiple flat top regions beingspaced apart within the second epitaxial layer.
 12. The method of claim11, wherein the multiple flat top regions have the same or differentdoping levels.
 13. The method of claim 12, wherein the multiple flat topregions have decreasing doping levels from a first flat top regionadjacent the first side of the second epitaxial layer to the a flat topregion adjacent the second side of the second epitaxial layer.
 14. Themethod of claim 11, wherein each of the flat top regions has athickness, the thickness of the multiple flat top regions being the sameor different.
 15. The method of claim 14, wherein the multiple flat topregions have decreasing thicknesses from a first flat top regionadjacent the first side of the second epitaxial layer to a last flat topregion adjacent the second side of the second epitaxial layer.
 16. Themethod of claim 11, wherein the background doping level is higher thanor the same as the constant doping level of the first epitaxial layer.17. The method of claim 7, wherein forming, by the epitaxial process,the second epitaxial layer of the first conductivity type on the firstepitaxial layer comprises: forming the second epitaxial layer having amultiple spike doping profile having a first doping level as abackground doping level and having multiple spike doping regions withspike increase in doping levels from the first doping level, themultiple spike doping regions being spaced apart within the secondepitaxial layer.
 18. The method of claim 7, wherein forming a gatedielectric layer and a conductive gate on the front side of thesemiconductor structure comprises: forming a trench gate dielectriclayer and a trench gate, the trench gate dielectric layer and the trenchgate being formed in a trench formed in the front side of thesemiconductor structure.
 19. The method of claim 7, wherein forming thebuffer layer on the second epitaxial layer comprises forming a thirdepitaxial layer as the buffer layer, the third epitaxial layer havingthe first conductivity type.
 20. The method of claim 7, wherein forminga bonding layer on the buffer layer comprises forming a thermal oxidelayer on the buffer layer.
 21. The method of claim 7, wherein the firstconductivity type comprises N-type conductivity and the secondconductivity type comprises P-type conductivity.
 22. The method of claim7, wherein forming a gate dielectric layer and a conductive gate on thefront side of the semiconductor structure comprises: forming the gatedielectric layer on a front surface on the front side of thesemiconductor structure; and forming the conductive gate on the gatedielectric layer on the front surface on the front side of thesemiconductor structure.